40G and 100G Ethernet technology is no longer a pipe dream for data centers its reality. As data centers of all types continue to grow in terms of traffic and. Project Name Maxim Pmod Fremont 16Bit, HighAccuracy, 0 to 100mV Input, Isolated Analog FrontEnd AFE. The Heart Of AMDs Epyc Comeback Is Infinity Fabric. July 12, 2017 Paul Teich At AMDs Epyc launch few weeks ago, Lisa Su, Mark Papermaster, and the. CLC020 www. ti. com SNLS046E FEBRUARY 2000 REVISED APRIL 2013 CLC020 SMPTE 259M Digital Video Serializer with Integrated Cable Driver Check for Samples CLC020. Upcoming Trends in Data Center Ethernet Technology. G and 1. 00. G Ethernet technology is no longer a pipe dream for data centers its reality. As data centers of all types continue to grow in terms of traffic and size, 1. G is set to become the new standard for high bandwidth and intelligent architecture. It will take some time to spread industry wide, but 1. G is well on its way. During the initial development of 4. G and 1. 00. G Ethernet, the IEEE 8. Ethernet working group considered only multimode optics and multimode fiber cable solutions with a reach of up to 1. G and 1. 00m for 1. G for data center applications. IEEE 4. 0G and 1. G singlemode fiber solutions have been developed for a reach of 1. Especially for 1. G Ethernet technology deployment in data centers, there was a huge gap between the 1. Hyperscale data centers need cost effective solutions for 5. CWDM based 2km reach. Because high volume physical medium dependent sublayers PMDs which define the details of transmission and reception of individual bits on a physical medium are missing in the IEEE Ethernet technology standard, non standard MSA PMDs have filled the gap At 4. G, there are four IEEE standard 4. G SR4, 4. 0G FR, 4. G LR4 and 4. 0G ER4 PMDs and six non standard PMDs 4. G Bi. Di, 4. 0G SWDM, 4. G e. SR4, 4. 0G PSM4, 4. G LR lite, 4. 0G UniversalAt 1. G, there are six IEEE PMDs 1. G SR1. 0, 1. 00. G SR4, 1. 00. G LR4, 1. G ER4, 1. 00. G SR2 and 1. G DR and eleven non standard PMDs 1. G e. SR4, 1. 00. G Bi. Di, 1. 00. G SWDM4, 1. 00. G PSM4, 1. G CWDM4, 1. 00. G CLR4, 1. G LR4 lite, 1. 00. G CWDM4 lite, 1. G e. CWDM4, 1. 00. G e. LR4 and 1. 00. G ER4 liteAccording to Light. Counting market reach, this year, more than 6. G PMD shipments, and more than 3. G PMD shipments, are from non standard PMDs. In 2. 01. 4 and 2. IEEE 8. 02. 3 formed 8. G and 4. 00. G and 8. G, 1. 00. G and 2. G taskforces for next generation Ethernet technology development many of the data center oriented PMDs have become the main focus of these taskforces. Their new objectives are to develop the following solutions to support cost effective data center interconnects 3m solution with twin axial direct attach copper DAC1. Industry Alliances and a Fragmented Market. Industry consortiums, such as the 2. G Ethernet Consortium, 1. G CWDM4 MSA, 1. 00. G CLR4 Alliance, 1. G PSM4 MSA and Open. Optics MSA, have paved the way for fast 2. G and 1. 00. G Ethernet technology development outside the IEEE 8. Ethernet working group. Along with the IEEE 8. G and 4. 00. G Ethernet technology interfaces and form factors, including 4. G CDFP MSA, 4. 00. G CFP8, 2. 00. G4. G QSFP Double Density MSA and 4. G OSFP MSA. To develop the application driven technologies not addressed in the IEEE 8. For example, the SWDM4 Alliance was formed to develop specifications for short wavelength division multiplexing SWDM in multimode fiber for 4. G and 1. 00. G applications. WDM MSA defines specifications for low cost, low power 1. G 4 2. 5G transceivers with 1. As speed and port density become bottlenecked, the Consortium for On Board Optics was formed to define specifications for next generation on board optics solutions as an alternative to current dominant edge pluggable optics. The data center ecosystem has evolved so quickly that it has become a fragmented market. For example, hyperscale data centers have different technology preferences and migration paths to suit their own applications and expansion plans. This will accelerate technology development and benefit the rest of the market in product availability for different market segments. New Ethernet Interface. To better understand the Ethernet roadmap, we must keep in mind that connectivity technology has always been developed to support switch ASICs application specific integrated circuits switch ASIC bandwidth is driven by applications. Moving beyond 2. 5G per lane speed, the switch ASICs in BGA ball grid array packages will require eventual migration to higher electrical lane speeds to support higher bandwidth switch ASIC connectivity is mainly limited by the serializer deserializer Ser. Des IO. The industry recognizes the value of leveraging common technology developments across multiple applications by implementing multiple lane configurations, such as 5. G in single lane, 1. G in two lanes and 2. G in four lanes. For example, the QSFP double density QSFP DD form factor will be developed to support 2. G and 4. 00. G Ethernet technology applications with eight parallel electrical lanes QSFP is another MSA form factor under development to support 4 the lane density of SFP in a similar form factor. Next generation Ethernet form factors Source Ethernet AllianceOn board optics Source AvagoBroadcomAnother exciting technology development involves on board optics OBO that allow placement of optical modules very close to switch ASIC IO this eases signal integrity issues and considerably improves switch faceplate density. OBO specifications are under development by the Consortium for On Board Optics COBO, which will allow attaching high density MPO connectors directly at the faceplate. For example, with 5. G per lane technology, a 3. MPO 1. 2 Base 8 interface can support a bandwidth of 6. Tbps with a single wavelength, or 2. Tbps with four wavelengths per fiber. If your organization is planning next generation Ethernet technology deployment and has unanswered questions, contact Belden. Our data center experts can help you prepare for 4. G, 1. 00. G and beyond.
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